1～15 item / All 17 items
2nd/3rd generation Core i3/Celeron equipped CPU module
Features ■ 2nd/3rd Gen Core i3/Celeron ■ DDR3 SO-DIMM x 2 (up to 16GB) ■ Equipped with VGA, DisplayPort, DVI-I, and 24-bit single channel LVDS ■ Includes watchdog timer and digital I/O
Socket LGA1151 6th generation Core i7/i5/i3 Skylake-S compatible CPU module new
Features ■ Supports 6th generation Core i7/i5/i3 Skylake-S processors (LGA1151) ■ DDR4-2133 ECC/Non-ECC SODIMM x 1 (up to 16GB) ■ Supports VGA, LVDS/eDP, 2x DDI (DP/HDMI/DVI) displays (carrier board) ■ PCI Express 3.0 [x16] x 1 (carrier board)
6th generation Core i7/i5/i3/Celeron Skylake-H equipped CPU module new
Features ■ Type 6 COM Express module ■ Equipped with 6th generation Core i7/i5/i3/Celeron Skylake-H processors ■ DDR4-2133 ECC/Non-ECC SODIMM x 2 (up to 32GB) ■ Supports VGA, LVDS/eDP, 2x DDI (DP/HDMI/DVI) displays (carrier board) ■ PCI Express Gen3 compatible (carrier board)
Equipped with Pentium N4200/Celeron N3350/Atom E3950/E3940/E3930 CPU
Features ■ Equipped with Pentium N4200/Celeron N3350/Atom E3950/E3940/E3930 CPU. ■ Onboard memory 1867MHz DDR3L (up to 8GB) ■ Supports dual channel LVDS (18/24-bit), HDMI/DP++, DP++, and three independent display outputs. ■ 2x MIPI CSI camera (2/4 lanes) ■ 1x GbE with IEEE1588, 1x SATA 3.0, onboard eMMC ■ Extended operating temperature: -40℃ to +85℃ (optional)
Trizeps SODIMM-200 CPU module, NXP i.MX 8M Mini family
Features ■ Equipped with NXP i.MX 8M Mini application processor ■ Supports 1x Gigabit Ethernet, WiFi/Bluetooth, USB 2.0, LVDS ■ GC3202D accelerator + GCNanoUltra3D accelerator ■ Onboard LPDDR4-3200 memory up to 8GB ■ Operating temperature 0 to 70℃ (optional: -40℃ to 85℃) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android
NXP i.MX 8M Plus Family, ARM Cortex-A53, size 50x82mm
Features ■ Equipped with NXP i.MX8MPlus application processor ■ 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; 2x CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; supports QuadSPI interface ■ Integrated GPU supporting three independent displays ■ Onboard LPDDR4-4000 with up to 6GB memory ■ Operating temperature 0 to 60°C (optional: -40°C to 85°C) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with Linux OS
12th Core i series, 2xDDR5-4800 maximum 64GB memory, size 120x95mm
Features ■ Supports 12th generation Intel Core processors (Codename: Alder Lake – H series) ■ 2x 2.5GbE; 4x USB4 Gen 2x2; 4x USB2.0; 8x PCIe x1 Gen3, 1x PCIe x8 or 2x PCIe x4 Gen4; Optional on-board WiFi 6E + BT 5.2 ■ Intel Iris Xe Architecture with up to 96 EUs, up to 4 independent displays ■ Supports 2xDDR5-4800 memory up to 64GB ■ Operating temperature 0–60℃ (Optional: -40–85℃) ■ Dimensions: 120x95mm ■ OS Win Server2022/VxWorks7.0/Ubuntu/Linux/Yocto/Android
11th Xeon W-11000E/Core i series, equipped with 2xDDR4-3200 ECC, maximum 64GB memory.
Features ■ Supports 11th generation Intel Xeon, Core, and Celeron processors ■ 2x USB 4; 2x USB 3.2 Gen 2x2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; supports up to 2x 2.5GbE ■ Intel Iris Xe Graphics Core Gen12 GPU with up to 32 EU, supports up to 4 independent displays ■ Equipped with 2x DDR4-3200 ECC memory, maximum 64GB ■ Operating temperature 0 to 60℃ (optional: -40 to 85℃) ■ Dimensions: 120x95mm ■ OS: Win10 IoT/Linux/Yocto/VxWorks7.0/Android
6th generation Core i7-6600U/i5-6300U/i3-6100U/3955U Skylake-U equipped CPU module
Features ■ Type 6 COM Express module ■ Equipped with 6th generation Core i7-6600U/i5-6300U/i3-6100U/3955U Skylake-U ■ DDR4-1866 Non-ECC SODIMM x 1 (up to 16GB) ■ Supports VGA, LVDS/eDP, 2x DDI (DP/HDMI/DVI) displays (carrier board) ■ PCI Express Gen3 compatible (carrier board)
6th Generation Intel Xeon D (Broadwell-DE) processor equipped CPU module
Features ■ Type 6 COM Express module ■ Equipped with 6th generation Xeon D-1548/Xeon D-1539/Xeon D-1527 ■ DDR4-2133 ECC/Non-ECC SODIMM (up to 48GB) x3 ■ Supports VGA, HDMI, 10GbE LAN ■ PCI Express Gen3 compatible (1x PCIEx16, 8x PCIEx8)
7th generation Core i7/i5/i3/Xeon CPU equipped, type 6 CPU module
Features ■ Equipped with 7th generation Intel Core i7/i5/i3/Xeon CPU. ■ Intel QM175 / HM175 / CM238 chipset (old codename: Kaby Lake) included. ■ Memory 2133/2400MHz DDR4 SO-DIMM x2 (up to 32GB) ■ Supports 3x DDI channels, 1x LVDS (eDP), and 3 independent display outputs. ■ 8x PCIe [x1] (Gen3), 1x PCIe [x16] (Gen3) ■ GbE, 4x SATA3 (6Gb/s), 4x USB3.0, 4x USB2.0 ■ Supports Smart Embedded Management Agent (SEMA) functionality. ■ Extended operating temperature: -40℃ to +85℃ (optional)
type7 Xeon D-1700 (Ice Lake-D), 4xDDR4-2400/2666/2933 ECC maximum 128GB
Features ■ Intel Xeon D-1700 processors ■ 4x Superspeed USB 5Gbps; 16x PCI-e Gen4 lanes + 16x PCI-e Gen3 lanes ■ 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI ■ Up to four DDR4 SO-DIMM Slots supporting DDR4-2933 memory with ECC, up to 128GB
Trizeps SODIMM-200 CPU module (size 67.6x36.7mm), NXP i.MX 8M Plus
Features ■ Equipped with NXPi.MX8MPlus application processor ■ Supports 2x Gigabit Ethernet, 2x USB 3.0, 2x CAN-FD, PCIe, LVDS, 2x MIPI-CSI, WiFi/Bluetooth ■ Integrated GPU with multi-display support GC520L2D accelerator + GC7000UL3D accelerator ■ Onboard LPDDR4-4000 memory up to 8GB ■ Operating temperature 0 to 70°C (optional: -40°C to 85°C) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android
SM-C12, NXP i.MX 8M Family, ARM Cortex-A53, Size 50x82mm
Features ■ Equipped with NXP i.MX 8M Plus application processor ■ Supports WiFi + BT LE; CSI camera; QuadSPI interface; 14x GPI/Os ■ Integrated GPU that supports two independent displays ■ Onboard LPDDR4-4000 with a maximum of 6GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Yocto/Android
NXP i.MX 8X Family, ARM Cortex-A35, size 50x82mm
Features ■ Equipped with NXP i.MX 8X Plus application processor ■ 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; supports QuadSPI interface ■ Integrated GPU supporting two independent displays ■ Onboard LPDDR4-2400 with up to 4GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Android
